WOP | FemtoLAB

FemtoLAB is designed for diverse applications :

Working in the femtosecond laser field and exploring various research areas, it is crucial to have machine flexibility to tune it for different applications.

With an extensive background in process development, WOP | Workshop of Photonics understands how critical it is to match the demand of different research teams involved and enable all their needs.

Herewith, we offer FemtoLAB – a femtosecond laser micromachining workstation – for universal use.

FemtoLAB main features :

• Fabrication of complex objects with submicron resolution
• High-speed and ultra-high precision micromachining
• Efficient beam delivery and power control
• High-end industrial-grade femtosecond laser
• High-performance galvanometer scanners
• Object movement and laser pulse synchronization in time and space
• Unique software interface controlling all hardware units

FemtoLAB benefits :

• All-in-one platform : A workstation is designed to perform several applications, not just one
• Combined processes : A single workstation has integrated additive and subtractive process capabilities
• Submicron resolution : With a smallest feature size of 200 nm
• Full support : We will install the workstation at your premises and train your team
• References : Our systems are installed in a diverse range of businesses, research universities, and organizations
• 1 Year Warranty : And after-warranty service

Laser workstation technical specifications :

Key applications :

• Surface and volume micro- and nano- structuring
• Femtosecond laser ablation (FSLA)
• Laser grooving
• Multiphoton polymerization (MPP) | direct laser writing (DLW)
• Laser cutting & drilling
• Uniquely, the system is compatible not only with planar samples but supports optical fibers machining as well

Applications :

• Laser Micro Drilling
• Laser Micro Cutting
• Surface Structuring
• Multiphoton Polymerization

Application Examples :

• Laser cutting. Narrow and wide cuts of a silicon cantilever
• Blind holes drilling in multi layered sandwich like substrate - 25 μm thickness dielectric layer (blue color) drilling to gold layer (yellow color)
• Laser ablation | 500 μm thick Borofloat 33 glass sample after ablation of 100 μm slit and steam cleaning at 20x, top view
• Laser marking | selective gold layer removal. Gold, thickness ~10 μm, bottom layer ceramic substrate
• Multiphoton polymerization (MPP)
• Laser marking | Written directly inside the object (glass) by making refractive index irregularities without damaging the surface
• MPP - functional structures nanoprinting on existing functional devices
• Surface and volume micro- and nano- structuring
• Laser marking | selective gold layer removal. Gold, thickness ~10 μm, bottom layer ceramic substrate
• Laser marking | selective gold layer removal. Gold, thickness ~10 μm, bottom layer ceramic substrate
• Blind holes drilling in multi layered sandwich like substrate - 25 μm thickness dielectric layer (blue color) drilling to gold layer (yellow color)
• Laser ablation | 500 μm thick Borofloat 33 glass sample after ablation of 100 μm slit and steam cleaning at 20x, bottom view
• Glass wafer micro drilling with SLE
• Optical fibers drilling
• Metal surface grooving
• Metal steel foil drilling

Brochure & Datasheet :

   FemtoLAB Brochure (pdf / English)