The FemtoGLASS is a new glass & sapphire laser cutting and dicing workstation ideal for research & development, and volume manufacturing.
It is based on patented WOP glass & sapphire cutting technology, which is unique for ultra-high quality and precision results.
Understanding market needs and the growing demand for glass as a material, we have developed a unique state-of-the-art glass and sapphire cutting & dicing technology to overcome today’s market challenges.
Our technology outperforms other glass-cutting methods and thus is very well applicable in semiconductors, microfluidics, and micro-optics industries.
| Blade | Stealth laser | Laser ablation | WOP FemtoGLASS | |
| Glass thickness | 2 – 19 mm | 200 µm – 10 mm | 30 µm – 2 mm | 30 µm – 2 mm in a single pass |
| Glass type | All types | Non-tempered Sapphire |
All types | Tempered Non-tempered Sapphire |
| Cutting speed | up to 100 mm/s | Up to 300 mm/s | Up to 10 mm/s | Up to 800 mm/s |
| Possible shapes | Straight cuts only | T-shapes and circular shapes are possible | Any shape | Any shape possible |
| Surface chipping | < 200 µm | < 50 µm | < 50 µm | < 10 µm |
| Street requirement | > 50 µm | < 15 µm | > 50 µm | < 1 µm |
| Water (cooling/cleaning) | yes | no | yes | no |
| Debris | yes | no | yes | no |
| Thermal effect on the device | yes | no | yes | no |
FemtoGLASS main applications are glass wafer dicing, custom thin glass cutting, mobile phone screens, buttons, camera lens cutting, smart glasses screens cutting, micro-optics, etc.
It offers ultra-high quality and precision on tempered glass, non-tempered glass & sapphire, small feature sizes, and high aspect ratios unachievable with alternative technologies.
Quality of cut
